3D Defect Detection for bonding wire

A variety of defects such as broken wire, springing, parallel wire, and dropped wire of the chip gold wire may lead to 100% mandatory scrapping of the chip. The chip gold line 3D detection scheme of Yimu Technology can accurately locate the type and 3D orientation of defects through a single shot, and fundamentally prevent the problem of forced scrap caused by chip gold line defects.